1.2 GHz Solid State Power Amplifier - RF Section
The RF section was constructed from a kit from GH Engineering in the UK. The components are mounted on a Duroid circuit board that attaches to the massive heat sink you see in the picture.
The most difficult phase of construction was drilling and tapping the 50+ mounting holes in the heat sink - all without accidentally drilling completely through to the other side.
This portion of the SSPA mounts through a large hole in the bottom of the Hoffman box, and is sealed with the gasket you see. The box is the same length as the heat sink and barely longer than the PC board. That made machining tricky!